- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Patent holdings for IPC class H01L 23/467
Total number of patents in this class: 805
10-year publication summary
|
76
|
84
|
95
|
101
|
72
|
89
|
52
|
60
|
44
|
19
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 45621 |
26 |
| Siemens AG | 24990 |
23 |
| International Business Machines Corporation | 60644 |
22 |
| Mitsubishi Electric Corporation | 43934 |
14 |
| Huawei Technologies Co., Ltd. | 100781 |
14 |
| Microsoft Technology Licensing, LLC | 51439 |
14 |
| Toyota Motor Corporation | 28582 |
11 |
| Google LLC | 38759 |
11 |
| Fuji Electric Co., Ltd. | 4750 |
10 |
| Nidec Corporation | 2579 |
10 |
| General Electric Company | 18133 |
9 |
| Samsung Electronics Co., Ltd. | 131630 |
8 |
| Fujitsu Limited | 19265 |
8 |
| Micron Technology, Inc. | 24960 |
8 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
8 |
| Dell Products L.P. | 11144 |
8 |
| Apple Inc. | 50209 |
7 |
| Raytheon Company | 8535 |
7 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
7 |
| Asia Vital Components Co., Ltd. | 413 |
7 |
| Other owners | 573 |